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i.MX6 Solution

i.MX6 Based Embedded Computing Platform

i.MX6 Solution

Category: Solutions

Features

• Customized enclosure design
• NXP(Freescale) i.MX6 ARM® Cortex™-A9 processor
• Integrated 2D/3D graphic engine
• 7-inch WVGA LCD with G+G capacitive touchscreen
• Built-in WIFI, Bluetooth,4G/3G cellular modules(optional)
• High-efficient GPS module(optional)
• Support Android, Windows CE, Linux system
• Extended I/O ports: USB, RS232, RS485, RS422, Ethernet, GPIO, CAN Bus
• CAN Bus(2.0b) option ready
• Function hotkey preset

Overview

i.MX6 series solution for mobile data terminal is especially designed for intelligent transportation. Based on i.MX6 series ARM® Cortex™-A9 processor, the solution has higher and more reliable performance in vehicle applications. It integrats a variety of wireless communication modules such as WIFI, Bluetooth, 4G(3G) cellular and GPS. The final products may integrate a pigtail cable which is designed for more extension data communications, such as RS232, RS422, RS485, RJ45, USB, CANBUS, GPIOs etc. The solution works with Android 5.1.1 Lollipop,  Linux or Windows CE system, and we provide BSP support for it.

Soc Introduction

i.MX6 Quad Core Processor

Features

CPU Complex
  • 4x ARM® Cortex®-A9 up to 1.2 GHz per core
  • 1 MB L2 cache
  • 32 KB instruction and data caches
  • NEON SIMD media accelerator
Multimedia
  • GPU 3D
    • Vivante GC2000
    • 200Mtri/s 1000Mpxl/s, OpenGL ES 3.0 & Halti, CL EP
  • GPU 2D(Vector Graphics)
    • Vivante GC355
    • 300Mpxl/s, OpenVG 1.1
  • GPU 2D(Composition)
    • Vivante GC320
    • 600Mpxl/s, BLIT
  • Video Decode
    • 1080p 60 h.264
  • Video Encode
    • 1080p30 H.264 BP/ Dual 720p encode
  • Camera Interface
    • Types: 1x 20-bit parallel, MIPI-CSI2 (4 lanes), three simultaneous inputs
Memory
  • DDR
    • 2×32 LP-DDR2, 1×64 DDR3 / LV-DDR3
  • NAND
    • SLC/MLC, 40-bit ECC, ONFI2.2, DDR
Connectivity
  • Four USB2.0
    • 1xHS OTG + PHY
    • 1xHost + PHY
    • 2xHost USB HSIC
  • Ethernet
    • 1 Gbps + IEEE®1588
  • Expansion Ports
    • 3x SD/MMC 4.4, 1x SDXC
    • 5x SPI, 5x UART, 3x I²C
    • MIPI-HSI
    • PCIe 2.0 (1 lane)
Display
  • 2 x 4XGA (2048×1536)
  • or 2 x [1080p + WXGA (1280×720)]
Advanced Power Management
  • PMU integration
  • NXP PF100 power management unit
Security
  • High Assurance Boot
  • Cryptographic cipher engines
  • Random number generator
  • Tamper detection
Package and Temperature
  • 21 x 21mm, 0.8 mm BGA
  • Consumer (-20C to +105C), up to 1.2 GHz
  • Industrial (-40C to +105C), up to 800 MHz
  • Automotive (-40C to +125C), AEC-Q100, up to 1 GHz
i.MX6 Dual Core Processor

Features

CPU Complex
  • 2x ARM® Cortex™-A9 up to 1 GHz
  • 512 KB L2 cache
  • 32 KB instruction and data caches
  • NEON SIMD media accelerator
Multimedia
  • GPU 3D
    • Vivante GC880
    • 35Mtri/s 266Mpxl/s Open GL ES 2.0
  • GPU 2D(Vector Graphics)
    • Emulated on GPU 3D
  • GPU 2D(Composition)
    • Vivante GC320
    • 600Mpxl/s, BLIT
  • Video Decode
    • 1080p30 + D1
  • Video Encode
    • 1080p30 H.264 BP/ Dual 720p encode
  • Camera Interface
    • Types: 1x 20-bit parallel, MIPI-CSI2 (2 lanes)
Memory
  • DDR
    • 2×32 LP-DDR2, 1×64 DDR3 / LV-DDR3
  • NAND
    • SLC/MLC, 40-bit ECC, ONFI2.2, DDR
Connectivity
  • Four USB2.0
    • 1xHS OTG + PHY
    • 1xHost + PHY
    • 2xHost USB HSIC
  • Ethernet
    • 1 Gbps + IEEE®1588
  • Expansion Ports
    • 3x SD/MMC 4.4, 1x SDXC
    • 4x SPI, 5x UART, 3x I²C
    • MIPI-HSI
    • PCIe 2.0 (1 lane)
Display
  • 2 x WXGA (1366×786)
  • EPDC, LVDS, Parallel, MIPI-DSI
Advanced Power Management
  • PMU integration
  • NXP PF100 power management unit
Security
  • High Assurance Boot
  • Cryptographic cipher engines
  • Random number generator
  • Tamper detection
Package and Temperature
  • 21 x 21 0.8 mm BGA
  • Consumer (0C to +95C -20C to +105C or -20C to +105C), up to 1 GHz
  • Industrial (-40C to +105C), up to 800 MHz
  • Automotive (-40C to +125C)

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